A practical engineering partner for European OEMs building the next era of power electronics. Advanced SiC, GaN, MOSFET and IGBT devices, custom chip design, and Edge AI platforms — delivered through a global fabrication network.
Azal Semiconductors is a UK-based solutions company helping European OEMs and system manufacturers improve power efficiency, reduce thermal losses and accelerate product development.
We operate as the European interface for Rimal Semiconductors — Saudi Arabia's first fabless power semiconductor design company. Through this affiliation, Azal connects European technology companies with a world-class semiconductor network spanning design, fabrication, packaging and testing. Rather than functioning as a traditional distributor or manufacturer, Azal sits within the supply chain as a gateway — enabling advanced capabilities with improved efficiency, reduced lead times, and long-term lifecycle support.
Access to next-generation SiC, GaN, MOSFET and IGBT technologies — covering the full voltage and current range required for modern electrified systems.
Architecture definition, chip design across power, analog, mixed-signal and AI domains, prototyping, validation, tape-out and production.
Global foundry partnerships across Taiwan, South Korea and China — 8-inch, 12-inch and specialised SJ MOS/IGBT processes with full quality assurance.
System-level support from application engineers who understand your end product — not just the datasheet. Deep co-engineering from concept to volume.
Integrated AI computing card architecture combining AI memory, smart power semiconductors and high-efficiency PCB — a fast pathway for industrial intelligence.
MOSFETs accessible through Azal reach conversion efficiencies above 99%, against an industry norm near 97%. In real-world systems that delta compounds into reduced cooling, lower component stress and meaningful reductions in operational energy use.
Next-generation architecture with Zero Gate-Voltage Turn-Off capability, purpose-built for EV powertrains, renewable inverters and high-density systems.
High-frequency gallium nitride devices for server power supplies, fast chargers and any application where switching speed unlocks system-level efficiency.
High-efficiency power conversion for UPS systems, LED lighting drivers and industrial motor drives.
Industrial motor drives, inverters, welding equipment and appliances — with ISO 26262 and AEC-Q101 qualification pathways.
Integrated Edge AI Computing Card combining AI memory, smart power semiconductors and high-efficiency PCB — for industrial intelligence workloads.
From architecture definition through to mass production — 3-6 month customisation cycles for application-specific ICs tailored to your product.
Customer system specifications and electrical requirements are formally captured and documented.
Device architecture and power stage design using proven IP and industry-leading EDA tooling.
Evaluation devices delivered for customer testing and system-level validation.
Electrical, thermal and lifecycle validation including 1000-hour reliability testing.
Volume production executed through qualified global fabrication partners.
Long-term supply chain management, component lifecycle and engineering updates.
European HQ, customer engagement and technical support.
Corporate HQ, R&D centre and MENA regional hub.
Foundry partnerships — 8-inch wafers, 180nm process technology.
Advanced SJ MOS / IGBT specialisation, 130nm process.
Design centres and 12-inch fabrication for high-volume manufacturing.
Founders have collectively deployed over one billion semiconductor devices into energy, EVs, consumer electronics, tech and 5G infrastructure.
We position as a strategic partner — not just a component supplier. Engagement runs from initial concept through to volume production.
ISO 9001:2015, ISO 14001, ISO 26262, AEC-Q101, RoHS — with 1000-hour reliability validation for every batch.
A portfolio of over 700 core IP blocks and a growing catalogue of innovation and utility-model patents in semiconductor packaging and fabrication.
Existing designs ship from order to delivery in around 8 weeks; new custom designs including full reliability cycle in 11+ weeks.
Higher efficiency devices reduce Scope 3 operational emissions — aligned with UN SDGs 7, 9, 11, 12, 13 and 17.
21+ years designing 1B+ chips. Developed patented 175°C MOSFET technology. OSAT owner with extensive R&D and advanced chip design experience.
35+ years in chip design. Former senior leader at PSMC. Expert in power MOSFET, IGBT and SiC — from R&D through to high-volume manufacturing.
20+ years of semiconductor leadership across TSMC, Intel and Infineon. Extensive core chip design and device optimisation experience.
15 years in high-reliability electronic systems. High-power PCB designs for Lenovo, Acer, HP, Samsung and BYD.
Founder of a power device design company for automotive clients. Ex-leader at BYD, Huawei, Xiaomi, Bosch and Hyundai Motor Company.
Tell us about your system, your voltage class, your volumes. We'll come back with a first view on fit, lead time and the right engagement model.
Your enquiry is with our business team — you'll hear back within two working days.